Inventor
LEE DOOHWAN
JP40 patents
⚠️ This page may combine multiple inventors who share the name “LEE DOOHWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
24 patentsUS12205939B2Jan 21, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations75
US11444706B2Sep 13, 2022
Antenna module including communication module capable of determining abnormality of transmission or reception path
SAMSUNG ELECTRONICS CO LTD3 citations71
US11735532B2Aug 22, 2023
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD3 citations70
US11355445B2Jun 7, 2022
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD2 citations70
US11289456B2Mar 29, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations70
US11127646B2Sep 21, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations69
US12315822B2May 27, 2025
Methods of manufacturing a fan-out panel level semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12283446B2Apr 22, 2025
Switch and electronic device including the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11901301B2Feb 13, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12453107B2Oct 21, 2025
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11721577B2Aug 8, 2023
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11302572B2Apr 12, 2022
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11121069B2Sep 14, 2021
Semiconductor package including capping pad having crystal grain of different size
SAMSUNG ELECTRONICS CO LTD0 citations60
US12243791B2Mar 4, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US12015014B2Jun 18, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11791230B2Oct 17, 2023
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11342239B2May 24, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US12388046B2Aug 12, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations58
US11043446B2Jun 22, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations56
US11158581B2Oct 26, 2021
Semiconductor package having semiconductor chip between first and second redistribution layers
SAMSUNG ELECTRONICS CO LTD0 citations51
US11962341B2Apr 16, 2024
Electronic device and method for wireless communication
SAMSUNG ELECTRONICS CO LTD0 citations50
US11942458B2Mar 26, 2024
Semiconductor package including a through-electrode penetrating a molding part
SAMSUNG ELECTRONICS CO LTD0 citations50
US11581263B2Feb 14, 2023
Semiconductor package, and package on package having the same
SAMSUNG ELECTRONICS CO LTD0 citations48
US11676915B2Jun 13, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations44
NIPPON TELEGRAPH & TELEPHONE
9 patentsUS11202211B2Dec 14, 2021
OAM multiplexing communication system and OAM multiplexing communication method
NIPPON TELEGRAPH & TELEPHONE10 citations85
US11228363B2Jan 18, 2022
OAM multiplexing communication system and inter-mode interference elimination method
NIPPON TELEGRAPH & TELEPHONE5 citations72
US11139867B2Oct 5, 2021
Antenna displacement correction method and device for OAM multiplexing communication system
NIPPON TELEGRAPH & TELEPHONE5 citations72
US10873376B2Dec 22, 2020
OAM multiplexing communication system, OAM multiplexing transmission device, OAM multiplexing receiving device, and OAM multiplexing communication method
NIPPON TELEGRAPH & TELEPHONE1 citations62
US11201397B2Dec 14, 2021
Circuit and wireless device
NIPPON TELEGRAPH & TELEPHONE1 citations57
US11811143B2Nov 7, 2023
Oam multiplexing communication system and inter-mode interference elimination method
NIPPON TELEGRAPH & TELEPHONE0 citations51
US11411325B2Aug 9, 2022
OAM multiplexing communication system and OAM multiplexing communication method
NIPPON TELEGRAPH & TELEPHONE0 citations51
US11323165B2May 3, 2022
Wireless communication device and wireless communication method
NIPPON TELEGRAPH & TELEPHONE0 citations51
US11018749B2May 25, 2021
OAM multiplexing communication system and inter-mode interference compensation method
NIPPON TELEGRAPH & TELEPHONE0 citations51