Inventor

PAHL WOLFGANG

DE61 patents

⚠️ This page may combine multiple inventors who share the name “PAHL WOLFGANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PAHL WOLFGANG

PAHL WOLFGANG

MEMS package and method for the production thereof

Component comprising a chip in a cavity and a stress-reduced attachment

MEMS microphone, production method and method for installing

Component comprising a MEMS microphone and method for the production of said component

Sensor module and method for producing sensor modules

MEMS microphone and method for producing the MEMS microphone

Cased electrical component

Component with reduced temperature response, and method for production

Circuit board with flexible region and method for production thereof

MEMS-microphone

Electric component having a shallow physical shape, and method of manufacture

MEMS component, method for producing a MEMS component, and method for handling a MEMS component

EPCOS AG

Encapsulated component and method for the production thereof

Encapsulation for an electrical component and method for producing the same

Method of producing a surface wave component with a drain for pyroelectric voltage

Housing for an electric component, and method for producing a housing for an electric component

Multi-MEMS module

Method for applying a structured coating to a component

Encapsulated component comprising a MEMS component and method for the production thereof

Method for producing a sensor

SAW component with adhesive location and use thereof

Microphone and method for producing a microphone

TDK CORP

Electronic device with stud bumps

Lid, MEMS sensor component and methods of manufacturing

Electronic device and method for manufacturing an electronic device

Electronic device with stud bumps

Carrier substrate for stress sensitive device and method of manufacture

MEMS device stress-reducing structure

MEMS device with particle filter and method of manufacture

Top port microphone and method for the production of same

SIEMENS AG

Electronic component, in particular a component operating with surface acoustic waves

Electronic component in particular an saw component operating with surface acoustic waves and a method for its production

Method for the production of flip-chip mounting-ready contacts of electrical components

Method of producing an electronic component, in particular a surface acoustic wave component

Method of producing an attenuating structure on a surface wave component

SIEMENS MATSUSHITA COMPONENTS

Method of producing a surface acoustic wave component

Encapsulation for electronic components and method for producing the encapsulation

Method for producing an encapsulation for a SAW component operating with surface acoustic waves

Electrical component, in particular saw component operating with surface acoustic waves, and a method for its production

LEIDL ANTON

MEMS microphone

MEMS package and method for the production thereof

Electrical module comprising a MEMS microphone

Method of manufacturing a microphone

FEIERTAG GREGOR

Electrical component and production method

Miniaturized electrical component comprising an MEMS and an ASIC and production method

MEMS microphone

SNAPTRACK INC

MEMS component and method for encapsulating MEMS components

Method for producing a cased electrical component

Electric component with sensitive component structures and method for producing an electric component with sensitive component structures

BAUER CHRISTIAN

Wafer-level package and method for production thereof