Inventor
ZOU WEI
US108 patents
⚠️ This page may combine multiple inventors who share the name “ZOU WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ZTE CORP
11 patentsUS11063704B2Jul 13, 2021
Control method and device for a data packet duplication function, communication device, and storage medium
ZTE CORP8 citations84
US11647426B2May 9, 2023
Method and apparatus for processing IAB node information in IAB network
ZTE CORP3 citations73
US11051346B2Jun 29, 2021
Method and apparatus for random access
ZTE CORP2 citations73
US10736149B2Aug 4, 2020
Method and apparatus for random access
ZTE CORP3 citations73
US12501435B2Dec 16, 2025
Data forwarding for user equipment with data transmission
ZTE CORP0 citations63
US12432618B2Sep 30, 2025
Data forwarding in centralized unit and distributed unit split architectures
ZTE CORP0 citations63
US12363562B2Jul 15, 2025
Methods and devices for routing and bearer mapping configuration
ZTE CORP1 citations63
US12177021B2Dec 24, 2024
Control method and device for a data packet duplication function, communication device, and storage medium
ZTE CORP0 citations63
US11728935B2Aug 15, 2023
Control method and device for a data packet duplication function, communication device, and storage medium
ZTE CORP0 citations63
US12289747B2Apr 29, 2025
Method and apparatus for resource configuration for sidelink in Internet of vehicles
ZTE CORP0 citations62
US11818762B2Nov 14, 2023
Method and apparatus for random access
ZTE CORP0 citations62
APPLIED MATERIALS INC
10 patentsUS11430877B2Aug 30, 2022
Ion implantation to reduce nanosheet gate length variation
APPLIED MATERIALS INC2 citations71
US11699570B1Jul 11, 2023
System and method for hi-precision ion implantation
APPLIED MATERIALS INC3 citations69
US12424482B2Sep 23, 2025
Selective implantation into STI of ETSOI device
APPLIED MATERIALS INC0 citations63
US11948799B2Apr 2, 2024
Minority carrier lifetime reduction for SiC IGBT devices
APPLIED MATERIALS INC0 citations63
US11881405B2Jan 23, 2024
Methods for forming N-type buried layer in a substrate by performing non-doping implant through oxide layer formed over the substrate
APPLIED MATERIALS INC0 citations63
US11694897B2Jul 4, 2023
Backside wafer dopant activation
APPLIED MATERIALS INC0 citations63
US11444153B2Sep 13, 2022
Method of forming stress memorization layer on backside of semiconductor substrate and semiconductor device thereof
APPLIED MATERIALS INC0 citations63
US12308237B2May 20, 2025
Ion implantation to increase MOSFET threshold voltage
APPLIED MATERIALS INC0 citations62
US11728214B2Aug 15, 2023
Techniques for selective tungsten contact formation on semiconductor device elements
APPLIED MATERIALS INC0 citations62
US11424125B2Aug 23, 2022
Angled ion implant to reduce MOSFET trench sidewall roughness
APPLIED MATERIALS INC0 citations62
ZOU WEI
6 patentsUS9113483B2Aug 18, 2015
Methods and apparatus of spectrum sharing for cellular-controlled offloading using unlicensed band
ZOU WEI24 citations92
USD950461SMay 3, 2022
Car console liner
ZOU WEI6 citations86
USD938885SDec 21, 2021
Car console liner
ZOU WEI9 citations86
USD938886SDec 21, 2021
Car console liner
ZOU WEI5 citations73
US8295220B2Oct 23, 2012
Multicast service
ZOU WEI5 citations73
US9307550B2Apr 5, 2016
Evolved node B controlled centralized resource reuse for device-to-device and cellular users
ZOU WEI2 citations62
IBM
5 patentsUS7694719B2Apr 13, 2010
Patterned metal thermal interface
IBM18 citations93
US7268428B2Sep 11, 2007
Thermal paste containment for semiconductor modules
IBM25 citations93
US8021925B2Sep 20, 2011
Thermal paste containment for semiconductor modules
IBM9 citations84
US7898076B2Mar 1, 2011
Structure and methods of processing for solder thermal interface materials for chip cooling
IBM7 citations84
US7250576B2Jul 31, 2007
Chip package having chip extension and method
IBM17 citations84
SHEN GANG
2 patentsLI ZHENHONG
2 patentsSHANTOU CITY AHEAD TOYS CO LTD
1 patentALIBABA GROUP HOLDING LTD
1 patentMOTOROLA INC
1 patentEDWARDS DAVID L
1 patentWANG HAIFENG
1 patentFURMAN BRUCE K
1 patentHONGFUJIN PREC IND SHENZHEN
1 patentFENG XIANJUN
1 patentSIEMENS IND SOFTWARE INC
1 patentGENENTECH INC
1 patentTENCENT TECH SHENZHEN CO LTD
1 patentSHENZHEN XITIAN TECH CO LTD
1 patentSHANGHAI RES CENTRE FOR WIRELESS COMMUNICATIONS
1 patentUNIV BEIHANG
1 patentShowing the top 50 of 108 patents by PatentIndex Score.