Inventor
LIN ARTHUR K
US3 patents
Patents
3 patentsUS6764877B2Jul 20, 2004
Method of dissipating static electric charge from a chip assembly during a manufacturing operation
INTEL CORP13 citations82
US6858475B2Feb 22, 2005
Method of forming an integrated circuit substrate
INTEL CORP18 citations81
US6566741B2May 20, 2003
Grounding of package substrates
INTEL CORP12 citations71