Inventor

TSENG CHIN-YUAN

TW23 patents

⚠️ This page may combine multiple inventors who share the name “TSENG CHIN-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSENG CHIN-YUAN

TAIWAN SEMICONDUCTOR MFG CO LTD

Method for forming semiconductor device structure

High fin cut fabrication process

Method for integrated circuit manufacturing

High-density semiconductor device

Semiconductor device which includes Fins

Lithographic technique incorporating varied pattern materials

Fin patterning methods for increased process margin

Method for forming semiconductor device structure

Method of making semiconductor device which includes Fins

High-density semiconductor device

Method for forming semiconductor device structure

Semiconductor device which includes fins and method of making same

Fin patterning methods for increased process margins

Method for forming semiconductor device structure

Fin-like field effect transistor patterning methods for increasing process margins

Method of patterning

Fin patterning methods for increased process margins

High-density semiconductor device

Fin-like field effect transistor patterning methods for increasing process margins

Lithographic technique incorporating varied pattern materials

Method of manufacturing fins and semiconductor device which includes fins

Multiple directed self-assembly patterning process

MEDIATEK INC

Method of tuning parameters for image signal processing and camera system