Inventor
KIM BYONG-JOO
KR4 patents
Patents
4 patentsUS10147706B2Dec 4, 2018
Multi-chip package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations69
US9252123B2Feb 2, 2016
Multi-chip package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations67
US10679972B2Jun 9, 2020
Method of manufacturing multi-chip package
SAMSUNG ELECTRONICS CO LTD0 citations48
US9384105B2Jul 5, 2016
Method of detecting faults of operation algorithms in a wire bonding machine and apparatus for performing the same
SAMSUNG ELECTRONICS CO LTD0 citations46