Inventor
MATSUMOTO KAZUTAKA
JP29 patents
⚠️ This page may combine multiple inventors who share the name “MATSUMOTO KAZUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHARP KK
11 patentsUS7748694B2Jul 6, 2010
Sheet carrying device, document carrying device, image forming apparatus, and sheet carrying method
SHARP KK4 citations63
US7748693B2Jul 6, 2010
Sheet carrying device, document carrying device, image forming apparatus, and sheet carrying method
SHARP KK5 citations63
US12111595B2Oct 8, 2024
Optical scanning device, image forming apparatus, and control method for proper initialization of laser driver
SHARP KK0 citations52
US11537059B2Dec 27, 2022
Image forming device
SHARP KK0 citations52
US11531287B2Dec 20, 2022
Optical scanning device, image forming apparatus, and method for selecting component
SHARP KK0 citations52
US11415908B2Aug 16, 2022
Multi-beam light source driving device and image forming apparatus including same, and multi-beam light source driving method
SHARP KK0 citations52
US10990030B2Apr 27, 2021
Shading correction signal generation device, multifunction apparatus, and shading correction signal generation method for generating shading correction signal having desired level
SHARP KK0 citations52
US9170521B2Oct 27, 2015
Light beam detection circuit, light beam scan unit and image forming apparatus to detect light beam that changes light-amount thereof
SHARP KK0 citations52
US12360474B2Jul 15, 2025
Image-forming apparatus and method for suppressing generation of a density level difference caused by reciprocity failure
SHARP KK0 citations50
US12304223B2May 20, 2025
Optical scanning device, image forming apparatus, and control method
SHARP KK0 citations43
US11984702B2May 14, 2024
Optical scanning device, image-forming apparatus, and control method
SHARP KK0 citations41
TOSHIBA KK
7 patentsUS6054222AApr 25, 2000
Epoxy resin composition, resin-encapsulated semiconductor device using the same, epoxy resin molding material and epoxy resin composite tablet
TOSHIBA KK52 citations94
US6673310B2Jan 6, 2004
Solder material, device using the same and manufacturing process thereof
TOSHIBA KK19 citations92
US5043211AAug 27, 1991
Epoxy resin composition and a resin-sealed semiconductor device
TOSHIBA KK26 citations92
US7604154B2Oct 20, 2009
Thermosetting flux and solder paste
TOSHIBA KK10 citations83
US4719255AJan 12, 1988
Epoxy resin composition for encapsulation of semi-conductor device
TOSHIBA KK22 citations81
US7026379B2Apr 11, 2006
Copolymer resin composition and production process thereof
TOSHIBA KK7 citations72
US5252639AOct 12, 1993
Molding resin composition and molded electronic component
TOSHIBA KK0 citations51