Inventor
WENG CHUNG-MING
TW30 patents
Patents
30 patentsUS11244906B2Feb 8, 2022
Semiconductor structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11809000B2Nov 7, 2023
Photonic integrated circuit and package structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations74
US11664325B2May 30, 2023
Semiconductor structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11635566B2Apr 25, 2023
Package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11614592B2Mar 28, 2023
Semiconductor devices and methods of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11506843B1Nov 22, 2022
Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gap
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US12222545B2Feb 11, 2025
Package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US12566302B2Mar 3, 2026
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12442995B2Oct 14, 2025
Photonic integrated circuit and package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12374627B2Jul 29, 2025
Method of fabricating semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12360321B2Jul 15, 2025
Package structure, semiconductor device and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12210200B2Jan 28, 2025
Photonic semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12210188B2Jan 28, 2025
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12181722B2Dec 31, 2024
Structures and process flow for integrated photonic-electric ic package by using polymer waveguide
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12176282B2Dec 24, 2024
Manufacturing method of semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12164158B2Dec 10, 2024
Package having prism structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12105323B2Oct 1, 2024
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12040283B2Jul 16, 2024
Method of fabricating semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11953740B2Apr 9, 2024
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11947173B2Apr 2, 2024
Photonic semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11754780B2Sep 12, 2023
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11754794B2Sep 12, 2023
Semiconductor device including optical through via and method of making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11740415B2Aug 29, 2023
Structures and process flow for integrated photonic-electric IC package by using polymer waveguide
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11686908B2Jun 27, 2023
Photonic semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11640935B2May 2, 2023
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12362329B2Jul 15, 2025
Method of fabricating semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12266639B2Apr 1, 2025
Method of fabricating semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11935871B2Mar 19, 2024
Semiconductor package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12564089B2Feb 24, 2026
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11768338B2Sep 26, 2023
Optical interconnect structure, package structure and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52