Inventor
BROWN ANDREW J
US33 patents
⚠️ This page may combine multiple inventors who share the name “BROWN ANDREW J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
23 patentsUS11189409B2Nov 30, 2021
Electronic substrates having embedded dielectric magnetic material to form inductors
INTEL CORP2 citations72
US10700021B2Jun 30, 2020
Coreless organic packages with embedded die and magnetic inductor structures
INTEL CORP3 citations72
US11251113B2Feb 15, 2022
Methods of embedding magnetic structures in substrates
INTEL CORP2 citations70
US12494443B2Dec 9, 2025
Substrate integrated thin film capacitors using amorphous high-k dielectrics
INTEL CORP0 citations62
US11881463B2Jan 23, 2024
Coreless organic packages with embedded die and magnetic inductor structures
INTEL CORP0 citations62
US11804455B1Oct 31, 2023
Substrate integrated thin film capacitors using amorphous high-k dielectrics
INTEL CORP0 citations62
US11670504B2Jun 6, 2023
Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives
INTEL CORP0 citations62
US11622448B2Apr 4, 2023
Sandwich-molded cores for high-inductance architectures
INTEL CORP0 citations62
US11610706B2Mar 21, 2023
Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates
INTEL CORP0 citations62
US11574874B2Feb 7, 2023
Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch
INTEL CORP0 citations62
US11552010B2Jan 10, 2023
Dielectric for high density substrate interconnects
INTEL CORP0 citations62
US11495552B2Nov 8, 2022
Substrate integrated thin film capacitors using amorphous high-k dielectrics
INTEL CORP0 citations62
US11335632B2May 17, 2022
Magnetic inductor structures for package devices
INTEL CORP1 citations62
US11205626B2Dec 21, 2021
Coreless organic packages with embedded die and magnetic inductor structures
INTEL CORP0 citations62
US11824013B2Nov 21, 2023
Package substrate with reduced interconnect stress
INTEL CORP0 citations61
US11289263B2Mar 29, 2022
Electronic substrates having embedded magnetic material using photo-imagable dielectric layers
INTEL CORP0 citations61
US11862552B2Jan 2, 2024
Methods of embedding magnetic structures in substrates
INTEL CORP0 citations60
US11651902B2May 16, 2023
Patterning of thin film capacitors in organic substrate packages
INTEL CORP0 citations59
US10916486B2Feb 9, 2021
Semiconductor device including silane based adhesion promoter and method of making
INTEL CORP0 citations59
US11705389B2Jul 18, 2023
Vias for package substrates
INTEL CORP0 citations57
US11276618B2Mar 15, 2022
Bi-layer prepreg for reduced dielectric thickness
INTEL CORP0 citations56
US10692965B2Jun 23, 2020
3D conductive ink printing method and inductor formed thereof
INTEL CORP0 citations52
US10672859B2Jun 2, 2020
Embedded magnetic inductor
INTEL CORP0 citations52
R H ASSOCIATES LTD
4 patentsMONSANTO TECHNOLOGY LLC
3 patentsUS12110496B2Oct 8, 2024
Method of determining the zygosity of event MON 88302
MONSANTO TECHNOLOGY LLC2 citations69
US11193137B2Dec 7, 2021
Late season application of glyphosate for weed control in Brassica
MONSANTO TECHNOLOGY LLC0 citations58
US9738903B2Aug 22, 2017
Transgenic brassica event MON 88302 and methods of use thereof
MONSANTO TECHNOLOGY LLC0 citations48