P

Inventor

BROWN ANDREW J

US33 patents
⚠️ This page may combine multiple inventors who share the name “BROWN ANDREW J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

23 patents
US11189409B2Nov 30, 2021

Electronic substrates having embedded dielectric magnetic material to form inductors

INTEL CORP2 citations72
US10700021B2Jun 30, 2020

Coreless organic packages with embedded die and magnetic inductor structures

INTEL CORP3 citations72
US11251113B2Feb 15, 2022

Methods of embedding magnetic structures in substrates

INTEL CORP2 citations70
US12494443B2Dec 9, 2025

Substrate integrated thin film capacitors using amorphous high-k dielectrics

INTEL CORP0 citations62
US11881463B2Jan 23, 2024

Coreless organic packages with embedded die and magnetic inductor structures

INTEL CORP0 citations62
US11804455B1Oct 31, 2023

Substrate integrated thin film capacitors using amorphous high-k dielectrics

INTEL CORP0 citations62
US11670504B2Jun 6, 2023

Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives

INTEL CORP0 citations62
US11622448B2Apr 4, 2023

Sandwich-molded cores for high-inductance architectures

INTEL CORP0 citations62
US11610706B2Mar 21, 2023

Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates

INTEL CORP0 citations62
US11574874B2Feb 7, 2023

Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch

INTEL CORP0 citations62
US11552010B2Jan 10, 2023

Dielectric for high density substrate interconnects

INTEL CORP0 citations62
US11495552B2Nov 8, 2022

Substrate integrated thin film capacitors using amorphous high-k dielectrics

INTEL CORP0 citations62
US11335632B2May 17, 2022

Magnetic inductor structures for package devices

INTEL CORP1 citations62
US11205626B2Dec 21, 2021

Coreless organic packages with embedded die and magnetic inductor structures

INTEL CORP0 citations62
US11824013B2Nov 21, 2023

Package substrate with reduced interconnect stress

INTEL CORP0 citations61
US11289263B2Mar 29, 2022

Electronic substrates having embedded magnetic material using photo-imagable dielectric layers

INTEL CORP0 citations61
US11862552B2Jan 2, 2024

Methods of embedding magnetic structures in substrates

INTEL CORP0 citations60
US11651902B2May 16, 2023

Patterning of thin film capacitors in organic substrate packages

INTEL CORP0 citations59
US10916486B2Feb 9, 2021

Semiconductor device including silane based adhesion promoter and method of making

INTEL CORP0 citations59
US11705389B2Jul 18, 2023

Vias for package substrates

INTEL CORP0 citations57
US11276618B2Mar 15, 2022

Bi-layer prepreg for reduced dielectric thickness

INTEL CORP0 citations56
US10692965B2Jun 23, 2020

3D conductive ink printing method and inductor formed thereof

INTEL CORP0 citations52
US10672859B2Jun 2, 2020

Embedded magnetic inductor

INTEL CORP0 citations52

R H ASSOCIATES LTD

4 patents

MONSANTO TECHNOLOGY LLC

3 patents

UNIV OF PITTSBURGH—OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION

1 patent

BROWN ANDREW J

1 patent

GEORGIA TECH RES INST

1 patent