Inventor
ECTON JEREMY
US26 patents
Patents
26 patentsUS11791228B2Oct 17, 2023
Method for forming embedded grounding planes on interconnect layers
INTEL CORP2 citations71
US12422615B2Sep 23, 2025
Nested glass packaging architecture for hybrid electrical and optical communication devices
INTEL CORP1 citations63
US12481108B2Nov 25, 2025
Faraday rotator interconnect as a through-via configuration in a patch architecture
INTEL CORP0 citations62
US12224103B2Feb 11, 2025
Angled inductor with small form factor
INTEL CORP1 citations62
US11948848B2Apr 2, 2024
Subtractive etch resolution implementing a functional thin metal resist
INTEL CORP0 citations62
US11622448B2Apr 4, 2023
Sandwich-molded cores for high-inductance architectures
INTEL CORP0 citations62
US11404389B2Aug 2, 2022
In-situ component fabrication of a highly efficient, high inductance air core inductor integrated into substrate packages
INTEL CORP0 citations62
US12444672B2Oct 14, 2025
Hybrid bonding technologies with thermal expansion compensation structures
INTEL CORP0 citations61
US12394719B2Aug 19, 2025
Methods and apparatus to increase glass core thickness
INTEL CORP0 citations61
US12255147B2Mar 18, 2025
Electronic substrate having an embedded etch stop to control cavity depth in glass layers therein
INTEL CORP0 citations61
US11817349B2Nov 14, 2023
Conductive route patterning for electronic substrates
INTEL CORP0 citations61
US11694898B2Jul 4, 2023
Hybrid fine line spacing architecture for bump pitch scaling
INTEL CORP0 citations61
US11569160B2Jan 31, 2023
Patterning of dual metallization layers
INTEL CORP0 citations61
US12412868B2Sep 9, 2025
Microelectronic assemblies including interconnects with different solder materials
INTEL CORP0 citations60
US11528811B2Dec 13, 2022
Method, device and system for providing etched metallization structures
INTEL CORP0 citations60
US11116084B2Sep 7, 2021
Method, device and system for providing etched metallization structures
INTEL CORP0 citations60
US12074102B2Aug 27, 2024
Structural elements for application specific electronic device packages
INTEL CORP0 citations59
US11855125B2Dec 26, 2023
Capacitors with nanoislands on conductive plates
INTEL CORP0 citations51
US12517314B2Jan 6, 2026
High bandwidth optical interconnection architectures
INTEL CORP0 citations50
US12449600B2Oct 21, 2025
Position controlled waveguides and methods of manufacturing the same
INTEL CORP0 citations50
US11942334B2Mar 26, 2024
Microelectronic assemblies having conductive structures with different thicknesses
INTEL CORP0 citations50
US11652036B2May 16, 2023
Via-trace structures
INTEL CORP0 citations50
US10515824B2Dec 24, 2019
Enhanced etch anisotropy using nanoparticles as banking agents in the presence or absence of a magnetic or electrical field
INTEL CORP0 citations50
US12255130B2Mar 18, 2025
Airgap structures for high speed signal integrity
INTEL CORP0 citations48
US12033930B2Jul 9, 2024
Selectively roughened copper architectures for low insertion loss conductive features
INTEL CORP0 citations47
US12191161B2Jan 7, 2025
Multi-step isotropic etch patterning of thick copper layers for forming high aspect-ratio conductors
INTEL CORP0 citations44