Inventor
YELDANDI SATISH
US2 patents
Patents
2 patentsUS9704781B2Jul 11, 2017
Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods
MICRON TECHNOLOGY INC3 citations70
US9966347B2May 8, 2018
Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods
MICRON TECHNOLOGY INC0 citations49