Inventor
LIN TE-HSUN
TW6 patents
⚠️ This page may combine multiple inventors who share the name “LIN TE-HSUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
3 patentsUS11362045B2Jun 14, 2022
Chip package structure
IND TECH RES INST0 citations55
US11963295B2Apr 16, 2024
Circuit apparatus, manufacturing method thereof and circuit system
IND TECH RES INST0 citations54
US12232256B2Feb 18, 2025
Flexible hybrid electronic substrate and electronic textile including the same
IND TECH RES INST0 citations44
INNOLUX CORP
3 patentsUS12489048B2Dec 2, 2025
Semiconductor package device having at least one second metal line between two adjacent first metal lines of redistribution layer
INNOLUX CORP0 citations47
US12550760B2Feb 10, 2026
Semiconductor device
INNOLUX CORP0 citations46
US12538831B2Jan 27, 2026
Electronic device and manufacturing method thereof
INNOLUX CORP0 citations45