Inventor
SHIBAOKA SHINJI
JP6 patents
Patents
6 patentsUS5893308AApr 13, 1999
Method of positioning work piece and system therefor
TOKYO SEIMITSU CO LTD52 citations94
US5904136AMay 18, 1999
Wire saw and slicing method thereof
TOKYO SEIMITSU CO LTD55 citations93
US6145422ANov 14, 2000
Method of positioning work piece and system therefor
TOKYO SEIMITSU CO LTD38 citations91
US5857454AJan 12, 1999
Wire saw and method of slicing ingot by wire saw
TOKYO SEIMITSU CO LTD21 citations90
US5295331AMar 22, 1994
Method of chamfering semiconductor wafer
TOKYO SEIMITSU CO LTD41 citations88
US6067976AMay 30, 2000
Wafer cut method with wire saw apparatus and apparatus thereof
TOKYO SEIMITSU CO LTD18 citations83