Inventor

KUO HSUAN-TING

TW36 patents

⚠️ This page may combine multiple inventors who share the name “KUO HSUAN-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KUO HSUAN-TING

TAIWAN SEMICONDUCTOR MFG CO LTD

3D package structure and methods of forming same

Electronic device and manufacturing method thereof

Interconnect structure and method of fabricating same

Package structure

Package structure

Interconnect structures and methods of forming same

Manufacturing method of package on package structure

Interconnect joint protective layer apparatus and method

Interconnect structures and methods of forming same

Interconnection joints having variable volumes in package structures and methods of formation thereof

3D package structure and methods of forming same

3D package structure and methods of forming same

Interconnect structures and methods of forming same

Semiconductor device and method of manufacture

Reflow method and system

Semiconductor package and manufacturing method thereof

Manufacturing method of package on package structure

Package structure

Semiconductor device and method of manufacture

Reflow method and system

Manufacturing method of package on package structure

Semiconductor devices and methods of forming the same

3D package structure and methods of forming same

Package on-package structure with epoxy flux residue

Interconnect structures and methods of forming same

Semiconductor packaging and manufacturing method thereof

Interconnect structures and methods of forming same

Package-on-package structure with epoxy flux residue

Interconnect structure and method of fabricating same

Semiconductor package and manufacturing method of the same

Fan-out packages and methods of forming the same

Semiconductor structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG

Interconnect structures and methods of forming same

Package-on-package structure and method of forming same

Interconnect structure and method of fabricating same

Semiconductor packaging and manufacturing method thereof