Inventor · disambiguated record
Tai Chong Chai
Also filed as: CHAI TAI C · CHAI TAI CHONG
8 granted patents·1 pending application·67 citations·filing 1992–2017
83Inventor score
Files withINST OF MICROELECTRONICS4AGENCY SCIENCE TECH & RES2KRIPESH VAIDYANATHAN1SELVANAYAGAM CHERYL SHARMANI1TEXAS INSTRUMENTS INC1
Top patents by PatentIndex Score
9 records- 0158US5229329AMethod of manufacturing insulated lead frame for integrated circuitsTEXAS INSTRUMENTS INC·Filed 1992·Granted Jul 20, 1993·30 cites·4 claims
- 0253US5836520AApparatus for dispensing fluid in an array patternINST OF MICROELECTRONICS·Filed 1996·Granted Nov 17, 1998·18 cites·14 claims
- 0350US7189594B2Wafer level packages and methods of fabricationAGENCY SCIENCE TECH & RES·Filed 2004·Granted Mar 13, 2007·5 cites·25 claims
- 0445US5967577AApparatus for dispensing fluid in an array patternINST OF MICROELECTRONICS·Filed 1998·Granted Oct 19, 1999·12 cites·8 claims
- 0541US6621151B1Lead frame for an integrated circuit chipINST OF MICROELECTRONICS·Filed 2000·Granted Sep 16, 2003·2 cites·15 claims
- 0640US10755993B2Electrical connection structure, semiconductor package and method of forming the sameAGENCY SCIENCE TECH & RES·Filed 2017·Granted Aug 25, 2020·0 cites·4 claims
- 0740US2012126419A1Substrate Arrangement and a Method of Manufacturing a Substrate ArrangementKRIPESH VAIDYANATHAN·Filed 2008·Application pending·0 cites
- 0828US6583501B2Lead frame for an integrated circuit chip (integrated circuit peripheral support)INST OF MICROELECTRONICS·Filed 2000·Granted Jun 24, 2003·0 cites·25 claims
- 0924US9506823B2Bonding stress testing arrangement and method of determining stressSELVANAYAGAM CHERYL SHARMANI·Filed 2011·Granted Nov 29, 2016·0 cites·31 claims
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