Inventor
EMERICK ALAN JAMES
US3 patents
Patents
3 patentsUS6236115B1May 22, 2001
High density integrated circuit packaging with chip stacking and via interconnections
IBM342 citations98
US6187678B1Feb 13, 2001
High density integrated circuit packaging with chip stacking and via interconnections
IBM274 citations98
US6002177ADec 14, 1999
High density integrated circuit packaging with chip stacking and via interconnections
IBM408 citations98