Inventor
TSAI JEENHUEI S
US6 patents
Patents
6 patentsUS6807731B2Oct 26, 2004
Method for forming an electronic assembly
DELPHI TECH INC65 citations95
US6693239B2Feb 17, 2004
Overmolded circuit board with underfilled surface-mount component and method therefor
DELPHI TECH INC21 citations92
US7352070B2Apr 1, 2008
Polymer encapsulated electrical devices
DELPHI TECH INC8 citations68
US7553680B2Jun 30, 2009
Methods to provide and expose a diagnostic connector on overmolded electronic packages
DELPHI TECH INC2 citations61
US7268429B2Sep 11, 2007
Technique for manufacturing an overmolded electronic assembly
DELPHI TECH INC3 citations61
US7202571B2Apr 10, 2007
Electronic module with form in-place pedestal
DELPHI TECH INC0 citations50