Inventor
QUAH GUAN KENG
US5 patents
Patents
5 patentsUS6787392B2Sep 7, 2004
Structure and method of direct chip attach
SEMICONDUCTOR COMPONENTS IND37 citations89
US6835580B1Dec 28, 2004
Direct chip attach structure and method
SEMICONDUCTOR COMPONENTS IND28 citations86
US7144538B2Dec 5, 2006
Method for making a direct chip attach device and structure
SEMICONDUCTOR COMPONENTS IND13 citations79
US6852574B1Feb 8, 2005
Method of forming a leadframe for a semiconductor package
SEMICONDUCTOR COMPONENTS IND3 citations60
US7098051B2Aug 29, 2006
Structure and method of direct chip attach
SEMICONDUCTOR COMPONENTS IND4 citations59