Inventor

LIAN GUO FENG

CN3 patents

⚠️ This page may combine multiple inventors who share the name “LIAN GUO FENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ALPHA & OMEGA SEMICONDUCTOR

2 patents

US9520380B2Dec 13, 2016

Wafer process for molded chip scale package (MCSP) with thick backside metallization

ALPHA & OMEGA SEMICONDUCTOR0 citations39

US9245861B2Jan 26, 2016

Wafer process for molded chip scale package (MCSP) with thick backside metallization

ALPHA & OMEGA SEMICONDUCTOR0 citations35

NIU ZHIQIANG

1 patent

US8703545B2Apr 22, 2014

Aluminum alloy lead-frame and its use in fabrication of power semiconductor package

NIU ZHIQIANG0 citations32