Inventor

TRAN-QUINN THUY L

US3 patents

⚠️ This page may combine multiple inventors who share the name “TRAN-QUINN THUY L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GLOBALFOUNDRIES INC

2 patents

US9805977B1Oct 31, 2017

Integrated circuit structure having through-silicon via and method of forming same

GLOBALFOUNDRIES INC16 citations80

US9252133B2Feb 2, 2016

Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures

GLOBALFOUNDRIES INC1 citations50

IBM

1 patent

US8907494B2Dec 9, 2014

Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures

IBM2 citations61