Inventor
ONG PAIK WEN
MY4 patents
Patents
4 patentsUS10651127B2May 12, 2020
Ring-in-ring configurable-capacitance stiffeners and methods of assembling same
INTEL CORP10 citations82
US10950552B2Mar 16, 2021
Ring-in-ring configurable-capacitance stiffeners and methods of assembling same
INTEL CORP2 citations71
US10971444B2Apr 6, 2021
Voltage noise reduction of power delivery networks for integrated circuits
INTEL CORP0 citations54
US10636749B2Apr 28, 2020
Semiconductor package substrate support structures for ball-grid array cavities, and methods of assembling same
INTEL CORP1 citations50