Inventor · disambiguated record
Kwang-Youl Chun
Also filed as: CHUN KWANG-YOUL
9 granted patents·77 citations·filing 1999–2013
86Inventor score
Top patents by PatentIndex Score
9 records- 0186US6607983B1Method of processing a defect source at a wafer edge region in a semiconductor manufacturingSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Aug 19, 2003·44 cites·20 claims
- 0284US8791526B2Vertical type integrated circuit devices and memory devices including conductive lines supported by Mesa structures and methods of fabricating the sameYOON JAE-MAN·Filed 2010·Granted Jul 29, 2014·9 cites·14 claims
- 0372US8293603B2Methods of fabricating semiconductor devicesCHO KWAN-SIK·Filed 2011·Granted Oct 23, 2012·4 cites·18 claims
- 0467US7238584B2Methods of fabricating integrated circuit devices having resistors with different resistivities thereinSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 3, 2007·4 cites·23 claims
- 0563US8405185B2Semiconductor device and semiconductor module including the sameKIM BONG-SOO·Filed 2010·Granted Mar 26, 2013·2 cites·20 claims
- 0662US8557664B2Methods of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Oct 15, 2013·1 cites·11 claims
- 0747US8729658B2Integrated circuit devices having buried interconnect structures therein that increase interconnect densityKIM BONG-SOO·Filed 2013·Granted May 20, 2014·0 cites·11 claims
- 0841US6335285B1Method for manufacturing a globally planarized semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jan 1, 2002·10 cites·20 claims
- 0933US6171926B1Methods for fabricating integrated circuit capacitor electrodes using first and second insulating layers and a buffer layerSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jan 9, 2001·3 cites·18 claims
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