Inventor
PARK JUNG-HYUN
KR138 patents
⚠️ This page may combine multiple inventors who share the name “PARK JUNG-HYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
33 patentsUSD567203SApr 22, 2008
DVD recorder
SAMSUNG ELECTRONICS CO LTD70 citations98
USD541811SMay 1, 2007
A/V receiver
SAMSUNG ELECTRONICS CO LTD58 citations96
USD533157SDec 5, 2006
Set top box
SAMSUNG ELECTRONICS CO LTD49 citations96
USD530695SOct 24, 2006
DVD recorder
SAMSUNG ELECTRONICS CO LTD52 citations96
USD530693SOct 24, 2006
DVD player
SAMSUNG ELECTRONICS CO LTD48 citations96
USD530694SOct 24, 2006
DVD player
SAMSUNG ELECTRONICS CO LTD48 citations96
US9954917B2Apr 24, 2018
Transmitting apparatus, receiving apparatus, and control methods thereof
SAMSUNG ELECTRONICS CO LTD18 citations94
USD746293SDec 29, 2015
Keyboard for tablet computer
SAMSUNG ELECTRONICS CO LTD17 citations93
USD716289SOct 28, 2014
Tabletop computer
SAMSUNG ELECTRONICS CO LTD18 citations93
USD714784SOct 7, 2014
Tablet PC
SAMSUNG ELECTRONICS CO LTD30 citations93
USD614221SApr 20, 2010
Camcorder
SAMSUNG ELECTRONICS CO LTD21 citations93
USD567204SApr 22, 2008
DVD recorder
SAMSUNG ELECTRONICS CO LTD34 citations93
USD560181SJan 22, 2008
DVD recorder
SAMSUNG ELECTRONICS CO LTD33 citations93
USD560182SJan 22, 2008
DVD recorder
SAMSUNG ELECTRONICS CO LTD40 citations93
USD539770SApr 3, 2007
DVD player
SAMSUNG ELECTRONICS CO LTD36 citations93
USD539771SApr 3, 2007
Complex image player
SAMSUNG ELECTRONICS CO LTD39 citations93
USD539250SMar 27, 2007
Complex image player
SAMSUNG ELECTRONICS CO LTD39 citations93
USD537425SFeb 27, 2007
DVD recorder
SAMSUNG ELECTRONICS CO LTD43 citations93
USD529885SOct 10, 2006
DVD recorder
SAMSUNG ELECTRONICS CO LTD46 citations93
USD560627SJan 29, 2008
DVD recorder
SAMSUNG ELECTRONICS CO LTD35 citations92
USD560180SJan 22, 2008
DVD recorder
SAMSUNG ELECTRONICS CO LTD36 citations92
USD840391SFeb 12, 2019
Desktop computer
SAMSUNG ELECTRONICS CO LTD6 citations84
USD727312SApr 21, 2015
Portable computer
SAMSUNG ELECTRONICS CO LTD6 citations84
US9960944B2May 1, 2018
Receiving apparatus and decoding method thereof
SAMSUNG ELECTRONICS CO LTD7 citations83
US7245138B2Jul 17, 2007
POGO pin and test socket including the same
SAMSUNG ELECTRONICS CO LTD12 citations82
US11108498B2Aug 31, 2021
Receiving apparatus and decoding method thereof
SAMSUNG ELECTRONICS CO LTD1 citations73
US10439758B2Oct 8, 2019
Receiving apparatus and decoding method thereof
SAMSUNG ELECTRONICS CO LTD1 citations73
US10389777B2Aug 20, 2019
Transmitting apparatus, receiving apparatus, and control methods thereof
SAMSUNG ELECTRONICS CO LTD2 citations73
US10225297B2Mar 5, 2019
Transmitting apparatus, receiving apparatus, and control methods thereof
SAMSUNG ELECTRONICS CO LTD2 citations73
US10122383B2Nov 6, 2018
Channel decoding method and apparatus using structured priori information of preamble
SAMSUNG ELECTRONICS CO LTD2 citations73
US9565044B2Feb 7, 2017
Transmitting apparatus, receiving apparatus, and control methods thereof
SAMSUNG ELECTRONICS CO LTD6 citations73
US9300376B2Mar 29, 2016
Transmitting apparatus, receiving apparatus, and control methods thereof
SAMSUNG ELECTRONICS CO LTD3 citations73
US9276654B2Mar 1, 2016
Transmitter and signal transmitting method thereof
SAMSUNG ELECTRONICS CO LTD3 citations73
SAMSUNG ELECTRO MECH
13 patentsUS7992291B2Aug 9, 2011
Method of manufacturing a circuit board
SAMSUNG ELECTRO MECH9 citations84
US7858437B2Dec 28, 2010
Method for manufacturing a substrate with cavity
SAMSUNG ELECTRO MECH10 citations84
US7498205B2Mar 3, 2009
Method for manufacturing substrate with cavity
SAMSUNG ELECTRO MECH8 citations84
US7707715B2May 4, 2010
Method of fabricating multilayer printed circuit board
SAMSUNG ELECTRO MECH18 citations83
US9831415B2Nov 28, 2017
Piezoelectric vibration module
SAMSUNG ELECTRO MECH10 citations82
US7550316B2Jun 23, 2009
Board on chip package and manufacturing method thereof
SAMSUNG ELECTRO MECH5 citations74
US11812556B2Nov 7, 2023
Printed circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH1 citations73
US11096286B2Aug 17, 2021
Printed circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH1 citations73
US10674608B2Jun 2, 2020
Printed circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH2 citations73
US10076038B2Sep 11, 2018
Printed circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH2 citations73
US9999141B2Jun 12, 2018
Printed circuit board and method for manufacturing the same
SAMSUNG ELECTRO MECH2 citations73
US9674937B2Jun 6, 2017
Circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH5 citations73
US9578749B2Feb 21, 2017
Element embedded printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations73
PARK JUNG-HYUN
2 patentsUNIV YONSEI IACF
1 patentINDUSTRY-ACADEMIC COOPERATION FOUNDATION YONSEI UNIV
1 patentShowing the top 50 of 138 patents by PatentIndex Score.