Inventor · disambiguated record
Sheng-Feng Chung
Also filed as: CHUNG SHENG-FENG
10 granted patents·5 pending applications·11 citations·filing 2002–2022
81Inventor score
Top patents by PatentIndex Score
15 records- 0186US9579878B1Gravure printing system and method of using the sameIND TECH RES INST·Filed 2015·Granted Feb 28, 2017·3 cites·21 claims
- 0282US10001889B2Mesh electrode, sensing device, and electrode layerIND TECH RES INST·Filed 2015·Granted Jun 19, 2018·4 cites·14 claims
- 0375US9921699B2Conductive line structure and sensing device using the sameIND TECH RES INST·Filed 2015·Granted Mar 20, 2018·2 cites·26 claims
- 0464US9448672B2Touch panel structure and fabrication method for the sameIND TECH RES INST·Filed 2013·Granted Sep 20, 2016·2 cites·19 claims
- 0557US2023159749A1Stretchable electroconductive material, method for manufacturing the same, and device using the stretchable electroconductive materialZHEN DING TECH CO LTD·Filed 2021·Application pending·0 cites
- 0654US12205667B2Multi-die packageREALTEK SEMICONDUCTOR CORP·Filed 2022·Granted Jan 21, 2025·0 cites·8 claims
- 0754US11672108B2Method for manufacturing electromagnetic shielding filmZHEN DING TECH CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·10 claims
- 0853US11602921B2Elastic conductive composite fabric capable of detecting and providing electrical signals according to reflections of limbs and body movementsZHEN DING TECH CO LTD·Filed 2019·Granted Mar 14, 2023·0 cites·1 claims
- 0951US2021092840A1Conductive composition, conductive film, and circuit board using the sameZHEN DING TECH CO LTD·Filed 2019·Application pending·0 cites
- 1049US9395072B2Illumination deviceIND TECH RES INST·Filed 2015·Granted Jul 19, 2016·0 cites·20 claims
- 1146US2021348012A1Conductive ink and conductive element able to be stretchedZHEN DING TECH CO LTD·Filed 2020·Application pending·0 cites
- 1243US9811222B2Sensing structureIND TECH RES INST·Filed 2015·Granted Nov 7, 2017·0 cites·33 claims
- 1341US2003123651A1ADSL business-card type network interface cardFiled 2002·Application pending·0 cites
- 1437US11424206B2Chip package module including flip-chip ground pads and power pads, and wire-bonding ground pads and power padsREALTEK SEMICONDUCTOR CORP·Filed 2020·Granted Aug 23, 2022·0 cites·11 claims
- 1533US2013008687A1Conductive film structure capable of resisting moisture and oxygen and electronic apparatus using the sameIND TECH RES INST·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →