Inventor
DANNY KOH CHER HAU
MY5 patents
Patents
5 patentsUS10741466B2Aug 11, 2020
Formation of conductive connection tracks in package mold body using electroless plating
INFINEON TECHNOLOGIES AG3 citations67
US10325837B2Jun 18, 2019
Molded semiconductor package with C-wing and gull-wing leads
INFINEON TECHNOLOGIES AG2 citations64
US11296000B2Apr 5, 2022
Formation of conductive connection tracks in package mold body using electroless plating
INFINEON TECHNOLOGIES AG1 citations56
US12300559B2May 13, 2025
Semiconductor packages and methods for manufacturing thereof
INFINEON TECHNOLOGIES AG0 citations50
US11217511B2Jan 4, 2022
Quad package with conductive clips connected to terminals at upper surface of semiconductor die
INFINEON TECHNOLOGIES AG1 citations50