Inventor
RIELEY SHELDON C
US5 patents
Patents
5 patentsUS5608260AMar 4, 1997
Leadframe having contact pads defined by a polymer insulating film
IBM38 citations91
US5545921AAug 13, 1996
Personalized area leadframe coining or half etching for reduced mechanical stress at device edge
IBM34 citations89
US5776801AJul 7, 1998
Leadframe having contact pads defined by a polymer insulating film
IBM7 citations72
US5633047AMay 27, 1997
Electronic devices having metallurgies containing copper-semiconductor compounds
IBM15 citations72
US5576246ANov 19, 1996
Personalized area leadframe coining or half etching for reduced mechanical stress at device edge
IBM13 citations71