Inventor
MCDONNELL MYRA
US5 patents
Patents
5 patentsUS11329162B2May 10, 2022
Integrated circuit structures having differentiated neighboring partitioned source or drain contact structures
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US11056356B1Jul 6, 2021
Fluid viscosity control during wafer bonding
INTEL CORP5 citations70
US10720345B1Jul 21, 2020
Wafer to wafer bonding with low wafer distortion
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US11721554B2Aug 8, 2023
Stress compensation for wafer to wafer bonding
INTEL CORP2 citations68
US10707186B1Jul 7, 2020
Compliant layer for wafer to wafer bonding
INTEL CORP0 citations40