Inventor
OTHIENO MAURICE
US4 patents
Patents
4 patentsUS6933602B1Aug 23, 2005
Semiconductor package having a thermally and electrically connected heatspreader
LSI LOGIC CORP38 citations90
US6825563B1Nov 30, 2004
Slotted bonding pad
LSI LOGIC CORP17 citations82
US6777803B2Aug 17, 2004
Solder mask on bonding ring
LSI LOGIC CORP1 citations46
US7804167B2Sep 28, 2010
Wire bond integrated circuit package for high speed I/O
LSI LOGIC CORP1 citations45