Inventor

URAGAMI HIROSHI

JP3 patents

⚠️ This page may combine multiple inventors who share the name “URAGAMI HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOWA CORP

2 patents

US9728426B2Aug 8, 2017

Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member

TOWA CORP2 citations67

US9580827B2Feb 28, 2017

Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member

TOWA CORP1 citations46

FUJITSU LTD

1 patent

US7056770B2Jun 6, 2006

Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material

FUJITSU LTD19 citations89