Inventor

MIWA HIDEAKI

JP2 patents

⚠️ This page may combine multiple inventors who share the name “MIWA HIDEAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUI MINING & SMELTING CO

1 patent

US6905757B2Jun 14, 2005

Dielectric filler containing resin for use in formation of built-in capacitor layer of printed wiring board and double-sided copper clad laminate with dielectric layer formed using the same dielectric filler containing resin, and production method of double-sided copper clad laminate

MITSUI MINING & SMELTING CO15 citations81

IDEMITSU PETROCHEMICAL CHEMICA

1 patent

US5223641AJun 29, 1993

Carboxylic acid mixtures and process for producing the same

IDEMITSU PETROCHEMICAL CHEMICA3 citations53