Inventor
WILSON WILLIAM EARL
US8 patents
Patents
8 patentsUS5981880ANov 9, 1999
Electronic device packages having glass free non conductive layers
IBM33 citations92
US6265075B1Jul 24, 2001
Circuitized semiconductor structure and method for producing such
IBM24 citations89
US6739048B2May 25, 2004
Process of fabricating a circuitized structure
IBM12 citations73
US6131279AOct 17, 2000
Integrated manufacturing packaging process
IBM14 citations73
US5922517AJul 13, 1999
Method of preparing a substrate surface for conformal plating
IBM9 citations73
US6027858AFeb 22, 2000
Process for tenting PTH's with PID dry film
IBM11 citations70
US5905018AMay 18, 1999
Method of preparing a substrate surface for conformal plating
IBM3 citations62
US6547974B1Apr 15, 2003
Method of producing fine-line circuit boards using chemical polishing
IBM6 citations59