Inventor
RANGARAJ SUDARSHAN V
US3 patents
Patents
3 patentsUS7585693B2Sep 8, 2009
Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method
INTEL CORP6 citations54
US7288472B2Oct 30, 2007
Method and system for performing die attach using a flame
INTEL CORP2 citations51
US7719109B2May 18, 2010
Embedded capacitors for reducing package cracking
INTEL CORP0 citations49