Inventor
TAKADA MITSUYUKI
JP21 patents
Patents
21 patentsUS4993148AFeb 19, 1991
Method of manufacturing a circuit board
MITSUBISHI ELECTRIC CORP148 citations99
US5173844ADec 22, 1992
Integrated circuit device having a metal substrate
MITSUBISHI ELECTRIC CORP68 citations96
US5081562AJan 14, 1992
Circuit board with high heat dissipations characteristic
MITSUBISHI ELECTRIC CORP53 citations96
US4914815AApr 10, 1990
Method for manufacturing hybrid integrated circuits
MITSUBISHI ELECTRIC CORP101 citations96
US4942140AJul 17, 1990
Method of packaging semiconductor device
MITSUBISHI ELECTRIC CORP103 citations93
US4643798AFeb 17, 1987
Composite and circuit board having conductive layer on resin layer and method of manufacturing
MITSUBISHI ELECTRIC CORP33 citations92
US4629681ADec 16, 1986
Method of manufacturing multilayer circuit board
MITSUBISHI ELECTRIC CORP31 citations92
US4752555AJun 21, 1988
Method of manufacturing multilayer circuit board
MITSUBISHI ELECTRIC CORP25 citations88
US5459594AOct 17, 1995
Apparatus for inspecting on-off states of a scattering-type liquid crystal display panel
MITSUBISHI ELECTRIC CORP29 citations87
US5773879AJun 30, 1998
Cu/Mo/Cu clad mounting for high frequency devices
MITSUBISHI ELECTRIC CORP27 citations86
US4685203AAug 11, 1987
Hybrid integrated circuit substrate and method of manufacturing the same
MITSUBISHI ELECTRIC CORP22 citations82
US5672965ASep 30, 1997
Evaluation board for evaluating electrical characteristics of an IC package
MITSUBISHI ELECTRIC CORP9 citations74
US4645734AFeb 24, 1987
Composite having conductive layer on resin layer and method of manufacturing
MITSUBISHI ELECTRIC CORP9 citations74
US5059941AOct 22, 1991
Electrode structure for a thick film resistor
MITSUBISHI ELECTRIC CORP14 citations73
US4946709AAug 7, 1990
Method for fabricating hybrid integrated circuit
MITSUBISHI ELECTRIC CORP9 citations73
US4785157ANov 15, 1988
Method for controlling electric resistance of a compound-type resistors
MITSUBISHI ELECTRIC CORP12 citations73
US4783642ANov 8, 1988
Hybrid integrated circuit substrate and method of manufacturing the same
MITSUBISHI ELECTRIC CORP14 citations73
US5175399ADec 29, 1992
Wiring panel including wiring having a surface-reforming layer and method for producing the same
MITSUBISHI ELECTRIC CORP8 citations70
US4963389AOct 16, 1990
Method for producing hybrid integrated circuit substrate
MITSUBISHI ELECTRIC CORP12 citations69
US4898805AFeb 6, 1990
Method for fabricating hybrid integrated circuit
MITSUBISHI ELECTRIC CORP6 citations61
US5069745ADec 3, 1991
Process for preparing a combined wiring substrate
MITSUBISHI ELECTRIC CORP4 citations60