Inventor
CHYE CHEW BENG
SG8 patents
⚠️ This page may combine multiple inventors who share the name “CHYE CHEW BENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
7 patentsUS6576531B2Jun 10, 2003
Method for cutting semiconductor wafers
MICRON TECHNOLOGY INC153 citations96
US6737606B2May 18, 2004
Wafer dicing device and method
MICRON TECHNOLOGY INC51 citations91
US7018270B2Mar 28, 2006
Method and apparatus for cutting semiconductor wafers
MICRON TECHNOLOGY INC14 citations89
US6939199B2Sep 6, 2005
Method and apparatus for cutting semiconductor wafers
MICRON TECHNOLOGY INC15 citations89
US7057281B2Jun 6, 2006
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
MICRON TECHNOLOGY INC17 citations88
US7622798B2Nov 24, 2009
Integrated circuit devices with stacked package interposers
MICRON TECHNOLOGY INC4 citations59
US7425470B2Sep 16, 2008
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
MICRON TECHNOLOGY INC2 citations58