P

Inventor

NAKANISHI HIROYUKI

JP54 patents
⚠️ This page may combine multiple inventors who share the name “NAKANISHI HIROYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHARP KK

16 patents
US6072243AJun 6, 2000

Semiconductor integrated circuit device capable of surely electrically insulating two semiconductor chips from each other and fabricating method thereof

SHARP KK215 citations99
US5793108AAug 11, 1998

Semiconductor integrated circuit having a plurality of semiconductor chips

SHARP KK97 citations98
US6838748B2Jan 4, 2005

Semiconductor element with electromagnetic shielding layer on back/side face(s) thereof

SHARP KK70 citations97
US6552426B2Apr 22, 2003

Semiconductor device and method of manufacturing same

SHARP KK78 citations97
US6118184ASep 12, 2000

Semiconductor device sealed with a sealing resin and including structure to balance sealing resin flow

SHARP KK187 citations97
US5402255AMar 28, 1995

Liquid crystal panel module and tape carrier package for liquid crystal driver IC

SHARP KK66 citations95
US6104084AAug 15, 2000

Semiconductor device including a wire pattern for relaying connection between a semiconductor chip and leads

SHARP KK82 citations94
US7091616B2Aug 15, 2006

Semiconductor device having a leading wiring layer

SHARP KK42 citations92
US6921980B2Jul 26, 2005

Integrated semiconductor circuit including electronic component connected between different component connection portions

SHARP KK36 citations92
US6423102B1Jul 23, 2002

Jig used for assembling semiconductor devices

SHARP KK32 citations91
US7538442B2May 26, 2009

Semiconductor chip and semiconductor device

SHARP KK10 citations83
US5473189ADec 5, 1995

Lead frame for a semiconductor integrated circuit with outer leads having a staggered configuration

SHARP KK7 citations74
US7445958B2Nov 4, 2008

Semiconductor device having a leading wiring layer

SHARP KK6 citations73
US6940175B2Sep 6, 2005

Semiconductor device in which a plurality of electronic components are combined with each other

SHARP KK9 citations73
US6396157B2May 28, 2002

Semiconductor integrated circuit device and manufacturing method thereof

SHARP KK6 citations62
US6784528B2Aug 31, 2004

Semiconductor device with plating wiring connecting IC electrode pad to terminal

SHARP KK1 citations52

CANON KK

11 patents

TOYODA GOSEI KK

7 patents

SEIKO EPSON CORP

3 patents

HITACHI CHEMICAL CO LTD

1 patent

YAZAKI CORP

1 patent

UEHATA YOSHIHARU

1 patent

(unassigned)

1 patent

TDK CORP

1 patent

SUMITOMO WIRING SYSTEMS

1 patent

NIHON NOHYAKU CO LTD

1 patent

ITO MASAMI

1 patent

JAPAN SCIENCE & TECH CORP

1 patent

NAKANISHI HIROYUKI

1 patent

TAMAGAWA SEIKI CO LTD

1 patent

YAMAMOTO HIROFUMI

1 patent

JOTO VENT SYSTEM USA INC

1 patent

Showing the top 50 of 54 patents by PatentIndex Score.