Inventor
LEE HENG-YEN
TW4 patents
Patents
4 patentsUS7140753B2Nov 28, 2006
Water-cooling heat dissipation device adopted for modulized LEDs
HARVATEK CORP41 citations91
US7049639B2May 23, 2006
LED packaging structure
HARVATEK CORP33 citations91
US7211882B2May 1, 2007
LED package structure and method for making the same
HARVATEK CORP8 citations72
USD506187SJun 14, 2005
Metal base design for surface mount device LED (light emitting diode)
HARVATEK CORP9 citations72