P

Inventor

LOO KUM-WENG

SG8 patents
⚠️ This page may combine multiple inventors who share the name “LOO KUM-WENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ST MICROELECTRONICS ASIA

5 patents
US8013438B2Sep 6, 2011

Semiconductor package with a stiffening member supporting a thermal heat spreader

ST MICROELECTRONICS ASIA10 citations82
US7056765B2Jun 6, 2006

Semiconductor device package and method of manufacture

ST MICROELECTRONICS ASIA8 citations69
US7919361B2Apr 5, 2011

Semiconductor package with position member

ST MICROELECTRONICS ASIA0 citations49
US7745945B2Jun 29, 2010

Semiconductor package with position member

ST MICROELECTRONICS ASIA0 citations49
US7816182B2Oct 19, 2010

Simplified multichip packaging and package design

ST MICROELECTRONICS ASIA0 citations37

ST MICROELECTRONICS SRL

1 patent
US7061697B2Jun 13, 2006

Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding device

ST MICROELECTRONICS SRL10 citations71

ST MICROELECTRONICS RES & DEV

1 patent
US7880132B2Feb 1, 2011

Cap including a housing and optically transparent member to protect a camera module lens

ST MICROELECTRONICS RES & DEV5 citations55

LOO KUM WENG

1 patent
US8338943B2Dec 25, 2012

Semiconductor package with thermal heat spreader

LOO KUM WENG5 citations54