Inventor
JUSKEY FRANK
US12 patents
⚠️ This page may combine multiple inventors who share the name “JUSKEY FRANK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
7 patentsUS5444303AAug 22, 1995
Wire bond pad arrangement having improved pad density
MOTOROLA INC90 citations94
US5323947AJun 28, 1994
Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement
MOTOROLA INC58 citations94
US5679498AOct 21, 1997
Method for producing high density multi-layer integrated circuit carriers
MOTOROLA INC22 citations92
US5598967AFeb 4, 1997
Method and structure for attaching a circuit module to a circuit board
MOTOROLA INC21 citations92
US6069679AMay 30, 2000
Selective call receiver having a display module with integrated circuits and method therefor
MOTOROLA INC8 citations67
US6137690AOct 24, 2000
Electronic assembly
MOTOROLA INC9 citations66
US5716760AFeb 10, 1998
Method for plating a substrate to eliminate the use of a solder mask
MOTOROLA INC4 citations62
AMKOR TECHNOLOGY INC
3 patentsUS6546620B1Apr 15, 2003
Flip chip integrated circuit and passive chip component package fabrication method
AMKOR TECHNOLOGY INC99 citations95
US6356453B1Mar 12, 2002
Electronic package having flip chip integrated circuit and passive chip component
AMKOR TECHNOLOGY INC103 citations95
US6534338B1Mar 18, 2003
Method for molding semiconductor package having a ceramic substrate
AMKOR TECHNOLOGY INC26 citations90