Inventor · disambiguated record
Hyung Ju Choi
Also filed as: CHOI HYUNG JU
8 granted patents·26 citations·filing 2011–2016
81Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0191US9508683B1Semiconductor packages and methods for manufacturing the sameSK HYNIX INC·Filed 2016·Granted Nov 29, 2016·13 cites·20 claims
- 0275US9589905B2EMI shielding in semiconductor packagesSK HYNIX INC·Filed 2014·Granted Mar 7, 2017·4 cites·3 claims
- 0372US9502378B1Printed circuit boards having blind vias, method of testing electric current flowing through blind via thereof and method of manufacturing semiconductor packages including the sameSK HYNIX INC·Filed 2015·Granted Nov 22, 2016·2 cites·17 claims
- 0469US9184140B2Semiconductor packages having emi shielding layers, methods of fabricating the same, electronic systems including the same, and memory cards including the sameSK HYNIX INC·Filed 2014·Granted Nov 10, 2015·2 cites·6 claims
- 0563US8736075B2Semiconductor chip module, semiconductor package having the same and package moduleCHOI HYUNG JU·Filed 2011·Granted May 27, 2014·4 cites·4 claims
- 0662US10002851B2Semiconductor packages including chip enablement padsSK HYNIX INC·Filed 2016·Granted Jun 19, 2018·1 cites·4 claims
- 0746US9275959B2Semiconductor packages having EMI shielding layers, methods of fabricating the same, electronic systems including the same, and memory cards including the sameSK HYNIX INC·Filed 2015·Granted Mar 1, 2016·0 cites·9 claims
- 0832US9875990B2Semiconductor package including planar stacked semiconductor chipsSK HYNIX INC·Filed 2016·Granted Jan 23, 2018·0 cites·20 claims
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