Inventor
OKUZONO TAKAHISA
JP4 patents
Patents
4 patentsUS11604150B2Mar 14, 2023
Device for measuring bump height, apparatus for processing substrate, method of measuring bump height, and storage medium
EBARA CORP2 citations70
US10910334B2Feb 2, 2021
Device for inspecting a bump height surrounded by resist, device for processing a substrate, method for inspecting a bump height, and storage medium
EBARA CORP0 citations59
US11371155B2Jun 28, 2022
Method and apparatus for processing a substrate
EBARA CORP0 citations58
US10508352B2Dec 17, 2019
Method and apparatus for processing a substrate
EBARA CORP0 citations48