Inventor

LEE TIM H

US3 patents

⚠️ This page may combine multiple inventors who share the name “LEE TIM H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GLOBALFOUNDRIES US INC

2 patents

US11127678B2Sep 21, 2021

Dual dielectric layer for closing seam in air gap structure

GLOBALFOUNDRIES US INC6 citations79

US11705396B2Jul 18, 2023

Method to form air gap structure with dual dielectric layer

GLOBALFOUNDRIES US INC2 citations68

IBM

1 patent

US6965171B1Nov 15, 2005

Method and structure for selective thermal paste deposition and retention on integrated circuit chip modules

IBM21 citations89