Inventor

GRESCHNER JOHANN

DE69 patents

⚠️ This page may combine multiple inventors who share the name “GRESCHNER JOHANN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GRESCHNER JOHANN

IBM

Method of making structures with dimensions in the sub-micrometer range

Method for fabricating a very dense chip package

Very dense integrated circuit package

Force microscope and method for measuring atomic forces in multiple directions

Calibration standards for profilometers and methods of producing them

System for stamping an optical storage disk

Method of producing micromechanical sensors for the afm/stm profilometry

Method of producing micromechanical sensors for the AFM/STM profilometry and micromechanical AFM/STM sensor head

PECVD (plasma enhanced chemical vapor deposition) method for depositing of tungsten or layers containing tungsten by in situ formation of tungsten fluorides

Shadow projection mask for ion implantation and ion beam lithography

Pneumatically and electrostatically driven scanning tunneling microscope

Method of compensating the proximity effect in electron beam projection systems

Micromechanical atomic force sensor head

Method of making trenches with substantially vertical sidewalls in silicon through reactive ion etching

Structure with a silicon body having through openings

Very dense chip package

Method for producing a multi-step structure in a substrate

Micromechanical sensor fabrication process

Probe head arrangement for conductor line testing with at least one probe head comprising a plurality of resilient contacts

Method of producing a calibration standard for 2-D and 3-D profilometry in the sub-nanometer range

Micromechanical sensor for AFM/STM profilometry

Calibration standard for profilometers and manufacturing procedure

Calibration standard for 2-D and 3-D profilometry in the sub-nanometer range and method of producing it

Process for the creation of a thermal SiO2 layer with extremely uniform layer thickness

Calibration standard for 2-D and 3-D profilometry in the sub-nanometer range and method of producing it

Calibration standard for 2-D and 3-D profilometry in the sub-nanometer range and method of producing it

Ultrafine silicon tips for AFM/STM profilometry

Modular multilayer interwiring structure

Method of producing ultrafine silicon tips for the afm/stm profilometry

Method of manufacturing an optical storage disk

Process for fabricating silicon carbide films with a predetermined stress

Method of forming identically positioned alignment marks on opposite sides of a semiconductor wafer

Method of making mask for structuring surface areas

Alignment system for particle beam lithography

Method of exposure by means of corpuscular beam shadow printing

Ion generator for ionographic print heads

Manufacturing method for membrane lithography mask with mask fields

Very dense integrated circuit package and method for forming the same

Method of fabricating a field emission device

Very dense integrated circuit package

Method for producing deep vertical structures in silicon substrates

Process for fabricating arbitrarily shaped through holes in a component

Method of transferring a pattern into a radiation-sensitive layer

Contact probe arrangement for electrically connecting a test system to the contact pads of a device to be tested

Method of making adhesive metal layers on substrates of synthetic material and device produced thereby

Process for producing printed circuit boards with metallic conductor structures embedded in the insulating substrate

Contact device for releasably connecting electrical components

Field emission device with series resistor tip and method of manufacturing

Method of compensating the proximity effect in electron beam projection systems

ZEISS CARL SMT GMBH

Charged particle-optical systems, methods and components