Inventor
TSUJIMURA TAKEHISA
JP5 patents
Patents
5 patentsUS5081067AJan 14, 1992
Ceramic package type semiconductor device and method of assembling the same
FUJITSU LTD152 citations98
US5886408AMar 23, 1999
Multi-chip semiconductor device
FUJITSU LTD126 citations96
US4682207AJul 21, 1987
Semiconductor device including leadless packages and a base plate for mounting the leadless packages
FUJITSU LTD72 citations94
US6143590ANov 7, 2000
Multi-chip semiconductor device and method of producing the same
FUJITSU LTD51 citations93
US5055914AOct 8, 1991
Ceramic package type semiconductor device and method of assembling the same
FUJITSU LTD37 citations92