Inventor
LEE HSIANG-FAN
TW36 patents
⚠️ This page may combine multiple inventors who share the name “LEE HSIANG-FAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
19 patentsUS10461009B2Oct 29, 2019
3DIC packaging with hot spot thermal management features
TAIWAN SEMICONDUCTOR MFG CO LTD15 citations94
US9583415B2Feb 28, 2017
Packages with thermal interface material on the sidewalls of stacked dies
TAIWAN SEMICONDUCTOR MFG CO LTD30 citations94
US9735082B2Aug 15, 2017
3DIC packaging with hot spot thermal management features
TAIWAN SEMICONDUCTOR MFG CO LTD16 citations92
US10770405B2Sep 8, 2020
Thermal interface material having different thicknesses in packages
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US10707177B2Jul 7, 2020
Thermal interface material having different thicknesses in packages
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US10157813B2Dec 18, 2018
3DIC packaging with hot spot thermal management features
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9978660B2May 22, 2018
Package with embedded heat dissipation features
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9653427B2May 16, 2017
Integrated circuit package with probe pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10629545B2Apr 21, 2020
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US10629510B2Apr 21, 2020
Package with embedded heat dissipation features
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11916023B2Feb 27, 2024
Thermal interface material having different thicknesses in packages
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US9401395B2Jul 26, 2016
Decoupling MIM capacitor designs for interposers and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12165990B2Dec 10, 2024
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11961779B2Apr 16, 2024
3DIC packaging with hot spot thermal management features
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11587886B2Feb 21, 2023
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11133237B2Sep 28, 2021
Package with embedded heat dissipation features
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11037852B2Jun 15, 2021
3DIC packaging with hot spot thermal management features
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10867951B2Dec 15, 2020
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59
US10340242B2Jul 2, 2019
Semiconductor device and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
TAIWAN SEMICONDUCTOR MFG
13 patentsUS9281254B2Mar 8, 2016
Methods of forming integrated circuit package
TAIWAN SEMICONDUCTOR MFG1,794 citations98
US9257409B2Feb 9, 2016
Decoupling MIM capacitor designs for interposers and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG5 citations84
US7271083B2Sep 18, 2007
One-transistor random access memory technology compatible with metal gate process
TAIWAN SEMICONDUCTOR MFG15 citations83
US5926728AJul 20, 1999
Method for fabricating tungsten polycide contacts
TAIWAN SEMICONDUCTOR MFG10 citations72
US9269762B2Feb 23, 2016
Metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers
TAIWAN SEMICONDUCTOR MFG1 citations63
US9263415B2Feb 16, 2016
Decoupling MIM capacitor designs for interposers and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG1 citations63
US7355240B2Apr 8, 2008
Semiconductor product including logic, non-volatile memory and volatile memory devices and method for fabrication thereof
TAIWAN SEMICONDUCTOR MFG3 citations63
US6835640B2Dec 28, 2004
Method of forming a novel composite insulator spacer
TAIWAN SEMICONDUCTOR MFG4 citations63
US7884408B2Feb 8, 2011
One-transistor random access memory technology compatible with metal gate process
TAIWAN SEMICONDUCTOR MFG4 citations61
US5946599AAug 31, 1999
Method of manufacturing a semiconductor IC device
TAIWAN SEMICONDUCTOR MFG6 citations57
US8993405B2Mar 31, 2015
Method of fabricating metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers
TAIWAN SEMICONDUCTOR MFG0 citations52
US8994146B2Mar 31, 2015
Metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers
TAIWAN SEMICONDUCTOR MFG0 citations52
US7101758B2Sep 5, 2006
Poly-etching method for split gate flash memory cell
TAIWAN SEMICONDUCTOR MFG0 citations39