Inventor
POH YONG CHERN
MY4 patents
Patents
4 patentsUS10741466B2Aug 11, 2020
Formation of conductive connection tracks in package mold body using electroless plating
INFINEON TECHNOLOGIES AG3 citations67
US10325837B2Jun 18, 2019
Molded semiconductor package with C-wing and gull-wing leads
INFINEON TECHNOLOGIES AG2 citations64
US11296000B2Apr 5, 2022
Formation of conductive connection tracks in package mold body using electroless plating
INFINEON TECHNOLOGIES AG1 citations56
US7674657B2Mar 9, 2010
Method of manufacture of encapsulated package
INFINEON TECHNOLOGIES AG2 citations56