Inventor
FORTIN CLEMENT J
CA7 patents
Patents
7 patentsUS6739497B2May 25, 2004
SMT passive device noflow underfill methodology and structure
IBM31 citations91
US10586782B2Mar 10, 2020
Lead-free solder joining of electronic structures
IBM2 citations72
US7408264B2Aug 5, 2008
SMT passive device noflow underfill methodology and structure
IBM5 citations72
US7109592B2Sep 19, 2006
SMT passive device noflow underfill methodology and structure
IBM8 citations72
US10756041B1Aug 25, 2020
Finned contact
IBM3 citations71
US11043468B2Jun 22, 2021
Lead-free solder joining of electronic structures
IBM0 citations62
US10950573B2Mar 16, 2021
Lead-free column interconnect
IBM0 citations62