Inventor

CHO BYEONG-YEON

KR10 patents

⚠️ This page may combine multiple inventors who share the name “CHO BYEONG-YEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

7 patents

US10546844B2Jan 28, 2020

Stack package and method of manufacturing the stack package

SAMSUNG ELECTRONICS CO LTD15 citations82

US7374969B2May 20, 2008

Semiconductor package with conductive molding compound and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD9 citations82

US7928435B2Apr 19, 2011

Interposer chip and multi-chip package having the interposer chip

SAMSUNG ELECTRONICS CO LTD3 citations62

US12033991B2Jul 9, 2024

Package-on-package (PoP) semiconductor package and electronic system including the same

SAMSUNG ELECTRONICS CO LTD0 citations59

US11552062B2Jan 10, 2023

Package-on-package (PoP) semiconductor package and electronic system including the same

SAMSUNG ELECTRONICS CO LTD0 citations59

US10971484B2Apr 6, 2021

Package-on-package (PoP) semiconductor package and electronic system including the same

SAMSUNG ELECTRONICS CO LTD0 citations59

US10692846B2Jun 23, 2020

Package-on-package (PoP) semiconductor package and electronic system including the same

SAMSUNG ELECTRONICS CO LTD0 citations48

KWON HEUNG-KYU

1 patent

US8618671B2Dec 31, 2013

Semiconductor packages having passive elements mounted thereonto

KWON HEUNG-KYU6 citations72

KWON HEUNG KYU

1 patent

US9665122B2May 30, 2017

Semiconductor device having markings and package on package including the same

KWON HEUNG KYU6 citations69

KIM YONG-HOON

1 patent

US8253228B2Aug 28, 2012

Package on package structure

KIM YONG-HOON4 citations62