Inventor
KIM YOUNG CHEOL
KR23 patents
⚠️ This page may combine multiple inventors who share the name “KIM YOUNG CHEOL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
6 patentsUS7622333B2Nov 24, 2009
Integrated circuit package system for package stacking and manufacturing method thereof
STATS CHIPPAC LTD14 citations84
US7683467B2Mar 23, 2010
Integrated circuit package system employing structural support
STATS CHIPPAC LTD17 citations83
US7645638B2Jan 12, 2010
Stackable multi-chip package system with support structure
STATS CHIPPAC LTD13 citations83
US7985623B2Jul 26, 2011
Integrated circuit package system with contoured encapsulation
STATS CHIPPAC LTD2 citations62
US8012867B2Sep 6, 2011
Wafer level chip scale package system
STATS CHIPPAC LTD1 citations51
US7915738B2Mar 29, 2011
Stackable multi-chip package system with support structure
STATS CHIPPAC LTD0 citations51
SAMSUNG ELECTRONICS CO LTD
3 patentsKIM YOUNG CHEOL
3 patentsUS8710675B2Apr 29, 2014
Integrated circuit package system with bonding lands
KIM YOUNG CHEOL17 citations82
US8471374B2Jun 25, 2013
Integrated circuit package system with L-shaped leadfingers
KIM YOUNG CHEOL6 citations71
US8067272B2Nov 29, 2011
Integrated circuit package system for package stacking and manufacturing method thereof
KIM YOUNG CHEOL0 citations49