Inventor
SHARMA RAVINDER K
US6 patents
Patents
6 patentsUS4927505AMay 22, 1990
Metallization scheme providing adhesion and barrier properties
MOTOROLA INC184 citations97
US4880708ANov 14, 1989
Metallization scheme providing adhesion and barrier properties
MOTOROLA INC61 citations95
US5411400AMay 2, 1995
Interconnect system for a semiconductor chip and a substrate
MOTOROLA INC63 citations94
US5674780AOct 7, 1997
Method of forming an electrically conductive polymer bump over an aluminum electrode
MOTOROLA INC50 citations90
US5555341ASep 10, 1996
Waveguide with an electrically conductive channel
MOTOROLA INC7 citations73
US4946376AAug 7, 1990
Backside metallization scheme for semiconductor devices
MOTOROLA INC14 citations68