Inventor

SCHWAB SARAH

US2 patents

Patents

2 patents

US6650205B2Nov 18, 2003

Wafer-scale package for surface acoustic wave circuit and method of manufacturing the same

CLARISAY INC31 citations88

US6744336B1Jun 1, 2004

Wafer-scale package for surface acoustic wave circuit and method of manufacturing the same

CLARISAY INC8 citations69